Elizabeth Buitrago - Resume

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Education

Experience

R&D Project leader BiMOS Chips: November 2016 – Present

ABB Switzerland – Lenzburg (Switzerland)

• Development and benchmarking of novel buffer technologies compatible with ultra-thin > 200 mm wafers.
• Process flow assessment and tool set evaluation (laser anneal) for thin wafer backside processing of IGBTs.
• Process integration enabling Tvj(op) = 150 °C capability of 6.5kV, 900A IGBT HiPak Module.
• Project management and process integration of next generation low voltage Trench IGBTs in house and in foundry.
• Process and device TCAD simulations, device design, electrical characterization and testing of IGBTs. Support of engineering teams within ABB (production, product engineering).

Postdoctoral Research Scientist, Nanofabrication Lead: July 2014 – October 2016

Paul Scherrer Institute (PSI) & ASML, X-Ray Interference Lithography Group (XIL-II) – Villigen (Switzerland)

• PSI’s lead coordinator of international industrial collaboration with ASML (lithography systems manufacturer, the Netherlands) and multiple resist vendors worldwide.
• Process optimization and characterization of state-of the-art chemically amplified (CAR) and inorganic resist and materials for extreme ultraviolet (EUV) lithography at the Swiss Light Synchrotron Source (SLS).
• 10 nm half-pitch resolution achieved with CAR via ASML collaboration.
• Nanofabrication lead in the development of highly efficient diffraction gratings (masks) with novel materials for interference lithography (IL) at the Lab of Micro and Nanotechnology (LMN) in PSI.

Research Engineer (PhD Thesis): October 2010 – June 2014

EPFL, Nanoelectronic Devices Laboratory (Nanolab) – – Lausanne (Switzerland): Prof. A. M. Ionescu

• 3D vertically stacked silicon nanowire (SiNW) field effect transistor (FET) was realized as a proof-of-concept device for its future implementation into low cost biosensors.
• Led a multi-institution collaboration within two European projects (E-BRAINS and SiNAPS) that resulted in the successful microfluidic platform development, electrical characterization and surface functionalization for ultra-low concentration protein sensing.
• Research on high performance SiNW/Fin based FETs for biosensing (junctionless and enhancement mode).
• Careful design and fabrication of CMOS compatible process flow for robust 3D heterogeneous systems integration.
• 3D TCAD-Sentaurus process and device simulations, teaching and supervision of master students.

Research Assistant (Master Thesis): March 2010 – August 2010

Transport Processes and Reactions Laboratory – ETHZ (Switzerland): Prof. R. Von Rohr, Dr. C. Roth

• Temperature sensitive substrate powders treated in a plasma enhanced chemical vapor deposition (PECVD) downstream reactor to simultaneously disperse and mix with silica nanoparticles generated in plasma process.
• Different organosilicon precursors were investigated for the optimization of flowability and wettability process parameters important for transportation, encapsulation, and dosing of particles among other applications.
• Analytical methods: ATR-FTIR, X-ray Diffraction XRD, SEM, flowability measurements (ring shear tester), particle size distribution determination by laser diffraction, tensiometer (contact angle determination).

Research Assistant (Semester Work): Feb. 2009 – June 2009

Particle Technology Laboratory (PTL)-ETHZ (Switzerland): Prof. S. Pratsinis, Dr. H. Keskinen, Dr. A. Tricoli

• Research and development of SnO2 sensors with Ag Nanoelectrodes for sensing ultra-low concentrations of acetone as applicable for diabetes diagnostics.
• SnO2 nanostructured films synthesized by flame spray pyrolysis (FSP).
• Analytical methods: XRD, SEM, specific surface area calculated by BET nitrogen adsorption.

Process Engineer (Wet Process): Sept. 2007 - Oct. 2008

Micron Technology – 300 mm Wafer FAB, Manassas VA (USA)

• Direct and sustain process improvements using SPC.
• Strategically identify and analyze process failures.
• Audit process recipes, configure hardware, and use procedural methods to perform process enhancements.
• Identifying, understanding, and resolving defect issues, assisting area technicians troubleshooting problems, improving preventative maintenance procedures, and optimizing overall tool performance.
• Proficiency across all wet process modules and toolsets is necessary in order to be able to disposition lots efficiently, prevent scrap and continuously improve wet process capabilities.
• Process Modules and tool sets include: Wet Benches (Tel and DNS Electronics FC-3000, FC-3100), Ash and Descum (Axcelis - Rapid Strip), Single wafer processing, Nanospray and Scrub (SCREEN - DNS, SU-3000, SS-3000), Cu Plating (Semitool - Raider), Dry Bevel Etch (Sosul)

Projects

Primary Process Engineer (Metal Deposition): Jan. 2006 – Jan. 2007

AMI Semiconductor (now On Semiconductor), Pocatello ID (USA)

• Worked directly with production and the engineering team to review existing procedures and to identify and implement cost, quality and productivity improvements.
• Oriented in statistical analysis i.e. DOE, SPC and process capability.
• Responsibilities included sustaining, data analysis, continuous improvement of current procedures, cost savings, new process introduction.
• Tool sets: MRC, Heat Pulse 8108 Rapid Thermal Processor.

Projects

• Successfully implemented tables for AlSiCu target chambers on MRC metal sputtering tools that accounted for the unique deposition behavior of each.
• Modified specification procedures and provided training.
• Productivity was increased while human intervention and tool downtime was minimized by successfully eliminating time changes.

• Restructured Metal deposition paste cycles completely in order to reduce particle counts and improve defect density D0.
• Implemented periodic Process Switching (AlSiCu-TiW) for maximum tool performance.
• Reduced cost by eliminated thick aluminum paste.

• Directed split lot experiments to qualify lower cost AlSiCu target vendor to be used in MRC sputtering tools.
• Performed test statistics in MAP test parameters.

• Optimized RTP Recipe.

REU (Research Experience for Undergrads) Summer of 2003 and 2004

Developed novel processes for ultra pure water purification and recycle used for wafer rising. Developed photocatalytic membranes for degradation of extremely low concentrations of organics.

Skills

• Bilingual (Spanish, English), basic French and German (A2).

Honors And Activities

• Triton Engineering Council Representative for the American Institute of Chemical Engineers (AICHE) 2003-2005.
• Organization Staff for the International Conference on Micro and Nano Engineering (MNE) 2014, Lausanne-CH.
• Donald F. Othmer Sophomore Academic Excellence Award (AICHE)
• IEEE EPFL student branch member (2010 - present).

Publications

1. T. Nagai, H. Nakagawa, E. Buitrago, et al., Novel high sensitivity EUV photoresist for sub-7 nm node. Journal of Photopolymer Science and Technology 29 (2016), 475-478.
2. R. Fallica, E. Buitrago, Y. Ekinci. Comparative study of line roughness metrics of chemically amplified and inorganic resists for extreme ultraviolet. Journal of Micro/Nanolithography, MEMS, and MOEMS 15 (2016), 034003.
3. E. Buitrago, S. Nagahara, O. Yildirim, et al., Sensitivity enhancement of chemically amplified resists and performance study using extreme ultraviolet interference lithography. Journal of Micro/Nanolithography, MEMS, and MOEMS 15 (2016), 033502.
4. E. Buitrago, T.K. Kulmala, R. Fallica, et al., EUV lithography process challenges, Materials and Processes for Next Generation Lithography, Edited by A. Robinson, Elsevier, 2016.
5. E. Buitrago, S. Nagahara, O. Yildirim, et al., Sensitivity enhancement of chemically amplified resists and performance study using EUV interference lithography. The Journal of Micro/Nanolithography, MEMS, and MOEMS (JM3), (2016).s
6. E. Buitrago, R. Fallica, D. Fan et al., SnO x high-efficiency EUV interference lithography gratings towards the ultimate resolution in photolithography, Microelectronic Engineering, 155(2016) 44.
7. D. Fan, E. Buitrago, S. Yang et al., Patterning of nanodot-arrays using EUV achromatic Talbot lithography at the Swiss Light Source and Shanghai Synchrotron Radiation Facility, Microelectronic Engineering, 155(2016) 55.
8. T.S. Kulmala, E. Buitrago, M. Vockenhuber et al., Pattern collapse mitigation in inorganic resists via a polymer freeze technique, Microelectronic Engineering, 155(2016) 39.
9. R. Del Re, J. Passareli, E. Buitrago et al., Low-line edge roughness extreme ultraviolet photoresists of organotin carboxylates, The Journal of Micro/Nanolithography, MEMS, and MOEMS (JM3), 14 (2015) 4.
10. S. Rigante, P. Scarbolo, E. Buitrago et al., Sensing with Advanced Computing Technology: Fin Field Effect Transistors with High-K Gate Stack on Bulk Silicon. ACS nano, (2015).
11. T. S. Kulmala, M. Vockenhuber, E. Buitrago et al., Towards 10nm half-pitch in EUV lithography: results on resist screening and pattern collapse mitigation techniques. The Journal of Micro/Nanolithography, MEMS, and MOEMS (JM3), submitted (2015).
12. H. Guerin, H. Le Poche, E. Buitrago et al., Carbon nanotube gas sensor array for multiplex analyte discrimination. Sensors and Actuators B: Chemical 207, 833 (2015).
13. E. Buitrago, M. Fernández-Bolaños, Y.M. Georgiev, R. Yu, O. Lotty, J.D. Holmes, et al., Electrical Characterization of High Performance, Liquid Gated Vertically Stacked SiNW-Based 3D FET for Biosensing Applications, Sensors and Actuators B: Chemical, Under Review,(2014).
14. E. Buitrago, M. Fernández-Bolaños, S. Rigante, C.F. Zilch, N. Schröter, A.M. Nightingale, et al., The Top-Down Fabrication of a 3D-Integrated, Fully CMOS-Compatible FET Biosensor Based on Vertically Stacked SiNWs and FinFETs, Sensors and Actuators B: Chemical, 193(2014) 400.
15. E. Buitrago, G. Fagas, M. Fernández-Bolaños, Y.M. Georgiev, M. Berthomé, A.M. Ionescu, Junctionless Silicon Nanowire Transistors for the Tunable Operation of a Highly Sensitive, Low Power Sensor, Sensors and Actuators B: Chemical, 183(2013) 1.
16. E. Buitrago, M. Fernández-Bolaños, A.M. Ionescu, Vertically Stacked Si Nanostructures for Biosensing Applications, Microelectronic Engineering, 97(2012) 345.
17. M. Fernández-Bolaños, E. Buitrago, A.M. Ionescu, RF MEMS Shunt Capacitive Switches Using AlN Compared to Si3N4 Dielectric, Journal of Microelectromechanical Systems, 21(2012) 1229.
18. C. Roth, G. Oberbossel, E. Buitrago, R. Heuberger, P.R. von Rohr, Nanoparticle Synthesis and Growth in a Continuous Plasma Reactor from Organosilicon Precursors, Plasma Processes and Polymers, 9(2012) 119.

Conferences & Invited talks

1. E. Buitrago, A. Mesemanolis, C. Papadopoulos, et al., An advanced soft punch through buffer design for thin wafer IGBTs targeting lower losses and higher operating temperatures up to 200° C. ISPSD, Chicago, 2018.
2. S. Nagahara, M. Carcasi, E.Buitrago et al,. Photosensitized Chemically Amplified Resist (PSCAR) 2.0 for high-throughput and high-resolution EUV lithography: dual photosensitization of acid generation and quencher SPIE Advanced Lithography, San Jose, CA (2017)10146, 101460G.
3. E. Buitrago, M. Meeuwissen, O. Yildirim, et al., State-of-the-art EUV materials and processes for the 7nm node and beyond. SPIE Advanced Lithography, San Jose, CA (2017)10143, 101430T.
4. O. Yildirim, E. .Buitrago, R Hoefnagels, et al., Improvements in resist performance towards EUV HVM. SPIE Advanced Lithography, San Jose, CA (2017)10143 101430Q.
5. R. Fallica, E. Buitrago, Y. Ekinci. Comparative study of line roughness metrics of chemically amplified and inorganic resists for EUV. SPIE Advanced Lithography, San Jose, CA (2016), pp. 97790K.
6. E. Buitrago, R. Fallica, D. Fan, et al., From powerful industrial platform for EUV photoresist development to world record resolution by photon based lithography: EUV interference lithography at the Paul Scherrer Institute. International Materials Research Congress, Invited Talk, Cancun, Mexico (August, 2016).
7. T. Nagai, O. Nakagawa, E. Buitrago et al., Novel High Sensitivity EUV Photoresist for Sub-7 nm Node. ICPST-33, Invited Talk, Chiba, Japan (June 2016).
8. E. Buitrago, R. Fallica, D. Fan, et al., From powerful industrial platform for EUV photoresist development to world record resolution by photon based lithography: EUV interference lithography at the Paul Scherrer Institute. SPIE Optics and Photonics, Invited Talk, San Diego, CA (August, 2016).
9. E. Buitrago, S. Nagahara, O. Yildirim, et al., Sensitivity enhancement of chemically amplified resists and performance study using EUV interference lithography. SPIE Advanced Lithography, San Jose, CA (2016), pp. 97760Z.
10. S. Nagahara, M. Carcasi, E. Buitrago, et al., Challenge toward breakage of RLS trade-off for EUV lithography by Photosensitized Chemically Amplified Resist (PSCAR) with flood exposure. SPIE Advanced Lithography, San Jose, CA (2016), pp. 977606.
11. T. Nagai, H. Nakagawa, E. Buitrago, et al., Novel high-sensitivity EUV photoresist for sub-7nm node, San Jose, CA (2016), pp. 977908.
12. R. Fallica, E. Buitrago, Y. Ekinci et al., Comparative study of line roughness metrics of chemically amplified and inorganic resists for EUV. SPIE Advanced Lithography, San Jose, CA (2016), pp. 97790K.
13. E. Buitrago, D. Fan, W. Karim et al., EUV Lithography at PSI. Shanghai Synchrotron Radiation Facility (SSRF), 2015.
14. E. Buitrago, O. Yildirim, C. Verspaget et al., Evaluation of EUV resist performance using interference lithography. SPIE Advanced Lithography, San Jose, CA (2015), pp. 94221S.
15. E. Buitrago, M. Fernández-Bolaños, Y.M. Georgiev, R. Yu, O. Lotty, J.D. Holmes, et al., Attomolar Streptavidin and pH Low Power Sensor Based on 3D Vertically Stacked SiNW FETs, International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), Hsinchu, Taiwan (2014).
16. E. Buitrago, M. Fernández-Bolaños, Y.M. Georgiev, R. Yu, O. Lotty, J.D. Holmes, et al., Functionalized 3D 7x20-array of Vertically Stacked SiNW FET for Streptavidin Sensing, 71th Annual Device Research Conference (DRC), Notre Dame, IN (2013).
17. E. Buitrago, G. Fagas, M. Fernández-Bolaños, Y.M. Georgiev, M. Berthomé, A.M. Ionescu, Junctionless Silicon Nanowire Transistors for the Tunable Operation of a Highly Sensitive, Low Power Sensor, International Conference on Biosensing Technology, Sitges, Spain (2013).
18. N. Schröter, E. Buitrago, M. Fernández-Bolaños, W. Raberg, M. Meindl, J. Schröter, et al., Immobilization of DNA to Planar and Nanostructured Chip-Surfaces for the Detection of Pathogen-Specific Biomolecules on a Magnetic Bead Based Diagnostic Platform, International Conference on Biosensing Technology, Sitges, Spain (2013).
19. E. Buitrago, M. Fernández-Bolaños, A.M. Ionescu, Vertically Stacked Silicon Nanowire for Biosensing Applications, Micro Nano Fabrication Annual Review Meeting, Lausanne, Switzerland (2013).
20. T. Bieniek, G. Janczyk, P. Janus, P. Grabiec, G. Wielgoszewski, T. Gotszalk, et al., Reliability and Robustness Investigation of 3D Vertically Stacked Silicon Nanowire Structures Using AFM Based Techniques, Nanotech Conference and Expo, Washington, DC, USA (2013).
21. T. Bieniek, G. Janczyk, P. Janus, P. Grabiec, M. Nieprzecki, G. Wielgoszewski, et al., Reliability and Robustness Investigation of Novel Nanosensor Structures Using AFM-based Techniques, Innovative Technologies in Medicine (ITMED), Bialystok, Poland (2013).
22. E. Buitrago, M. Fernández-Bolaños, Y.M. Georgiev, R. Yu, O. Lotty, J.D. Holmes, et al., Functionalized 3D 7x20-array of Vertically Stacked SiNW FET for Streptavidin Sensing, Swiss-Japanese Symposium on Nanomedicine and Imaging Frontiers EPFL, Lausanne, EPFL (2013).
23. T. Bieniek, G. Janczyk, P. Janus, P. Grabiec, M. Nieprzecki, G. Wielgoszewski, et al., Silicon Nanowires Reliability and Robustness Investigation Using AFM-based Techniques, Electron Technology Conference, Ryn, Poland (2013), p. 89022L.
24. E. Buitrago, G. Fagas, M. Fernández-Bolaños, A.M. Ionescu, Silicon Nanowires for Biosensing Applications, Zero Power Workshop, Barcelona, Spain (2012).
25. E. Buitrago, M. Fernández-Bolaños, A.M. Ionescu, Vertically Stacked Silicon Nanowire for Biosensing Applications, Micro Nano Fabrication Annual Review Meeting, Lausanne, Switzerland (2012).
26. T. Bieniek, G. Janczyk, P. Janus, P. Grabiec, G. Wielgoszewski, T. Gotszalk, et al., Reliability Investigation by Examination of dedicated MEMS/ASIC and NW’s Test Structures related to novel 3D SiP and Nano-Sensors Systems, IEEE International Workshop on Three-Dimensional Stacked Integrated Circuits (3D-Test), Anaheim, CA, USA (2012).
27. E. Buitrago, M. Fernández-Bolaños, A.M. Ionescu, 3D Vertically Stacked SiNWs for Biosensing Applications, LEA Micro-Engineering Workshop, Saline Royale d'Arc et Senans, France (2012).
28. E. Buitrago, M. Fernández-Bolaños, A.M. Ionescu, 3D Vertically Stacked Nanostructures for Biosensing Applications, International Conference on Micro and Nano Engineering (MNE), Berlin (2011).
29. E. Buitrago, M. Fernández-Bolaños, A.M. Ionescu, Vertically Stacked Silicon Nanowire for Biosensing Applications, Micro Nano Fabrication Annual Review Meeting, Lausanne, Switzerland (2011).